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Product

  • Product
  • Semiconductor

Cathode

Cathode technology is the most essential technology in sputtering equipment.
Cathode performance significantly impacts quality and mass production capability.
CNI Technology uses magnetic field simulation to develop, manufacture, and provide optimal cathodes  that satisfy the customer's desired process.

Rotatable cathode : CMC-RT

CNI Technology is Korea's first company to mass-produce rotatable cathodes successfully.
High-efficiency sputtering is possible using a cylindrical target.

Key Features
  • Easy to maintenance design with high reliability
  • Variable sputtering incident angle : 18˚ ~ 30˚
  • Supply customized magnet bar to fit process requirements
  • Variable sputtering tilting angle : 0˚ ~ 60˚
  • Patented dual magnet design for high efficiency
  • Thickness Non-uniformity : < ±5% (@ All layer)
  • Target erosion efficiency : ≥ 80%
  • Uniformity of RTR : ≤ ±3%
Rotatable cathode : CMC-RT 이미지
Rectangular cathode : CMC-R

Rectangular cathode is the most widely used product
since it is possible to manufacture cathodes in various sizes.

Key Features
  • Target width : ~ 200mm
  • Multi-zone gas supply
  • Target length : ~ 3,000mm
  • Mass flow control for process gas
  • Target erosion efficiency : ≥ 40%
  • RF, DC, Pulsed DC compatible
  • Metal & oxide target
Rectangular cathode : CMC-R 이미지
Moving magnetron cathode : CMC-M

Moving magnetron cathodes enable high-efficiency sputtering for large-area targets
as the magnet array scans the rear of the target using a servo motor or a rotary actuator.

Key Features
  • High target erosion efficiency : ≥ 60 %
  • RF, DC compatible
  • Widest range target available : ≥ 200㎜
  • Cooling path imbedded backing plate for high cooling efficiency
  • Magnet block control by servo motor
  • Imbedded gas supply unit
Moving magnetron cathode : CMC-M 이미지
Dual magnetron cathode : CMC-D

The dual magnetron cathode consists of two symmetrical targets,
with power applied independently to each target.

Key Features
  • Target erosion efficiency : ≥ 40%
  • Middle frequency power supply
  • Cathode for reactive sputter
  • Direct cooling on magnet block without magnet corrosion
  • Two magnetron with an asymmetric magnetic design
Dual magnetron cathode : CMC-D 이미지
Circular cathode : CMC-C

We possess circular cathode technology in various sizes from 2 to 14 inches.
In particular, we removed the re-deposition area in the target's central area
to suppress plasma arcing and remove particle issues.

Key Features
  • Target erosion efficiency : > 40 %
  • Uniformity : ≤ 5 %
  • RF, DC, Pulsed DC compatible
  • Metal & oxide target
  • Target size : 4~16 inch
Circular cathode : CMC-C 이미지