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  • Semiconductor

EMI Sputter

With regard to the latest mobile devices, issues related to electromagnetic shielding are emerging due to the increase
in the number of semiconductors operating at different frequencies.
In the past, electromagnetic shielding was performed at the PCB board level; however, it is now faced with the limitations of weight reduction and thinness.
With the development of electromagnetic shielding method at the semiconductor package level,
the paradigm for electromagnetic shielding has changed.
CNI Technology has successfully developed in-line sputtering for the formation of electromagnetic shielding films on semiconductor packages,
providing customized solutions for each type of semiconductor packages.

ShieldRus-1200

ShieldRus-1200 is a systemthat performs electromagnetic shielding process
using a sputtering method on semiconductor packages and specializes in mass production.

Key Features
  • Compact layout configuration using a cubicle in-line method
  • High-speed production capacity
  • Easy maintenance
  • Ultra low sputtering temp
ShieldRus-1200 이미지
Item ShieldRus-1200 ShieldRus-1200s ShieldRus-300H
3D drawing 제품이미지 제품이미지 제품이미지
Tact Time 6 min(3.5 um at top) 6 min(3.5 um at top) 30 min(3.5 um at top)
Cooling Type Active cooling Active cooling Active cooling
Temperature < 120℃ (with MF-Seal & Pi tape) < 120℃ (with MF-Seal & Pi tape) < 120℃ (with MF-Seal & Pi tape)
PKG Handling Material PI tape and MF-Seal PI tape and MF-Seal PI tape and MF-Seal
UPH Ø300 Standard ring frame 40ea Ø300 Standard ring frame 10ea Ø300 Standard ring frame 2ea
VS-300

VS-300 is a system that masks the bottom surface of BGA semiconductor packages
at low cost prior to EMI sputtering through the use of vacuum and special masking tape.

Key Features
  • Low cost solution
  • Applied in the vacuum process
  • Uses a special masking tape
VS-300 이미지
CURUS-C200™ :Cluster dispenser

The CURUS200 series is a self-standing cluster system for H-VAMs™ application.
It is possible to change the dispenser quantity flexibly according to the tact time.

Key Features
  • Process sequence: H-VAMs™ application > planarization > temperature rise > curing > temperature drop
  • Non-uniformity of H-VAMs™ thickness: ≤ ±5%
  • High reliability due to independent unit process operation
  • Equipment size
  • High productivity
CURUS-C200™ :Cluster dispenser 이미지