With regard to the latest mobile devices, issues related to electromagnetic shielding are emerging due to the increase
in the number of semiconductors operating at different frequencies.
In the past, electromagnetic shielding was performed at the PCB board level; however, it is now faced with the limitations of weight reduction and thinness.
With the development of electromagnetic shielding method at the semiconductor package level,
the paradigm for electromagnetic shielding has changed.
CNI Technology has successfully developed in-line sputtering for the formation of electromagnetic shielding films on semiconductor packages,
providing customized solutions for each type of semiconductor packages.