H-VAMs
High-viscosity adhesive materials (H-VAMs™) are materials used for
handling semiconductor packages within sputtering systems.
H-VAMs™ ensure easy manufacturing and attachment/detachment
to/from semiconductor packages as the most important factor for mass production.
Co-developed by CNI Technology and Shin-Etsu Co., Ltd., H-VAMs™
can be customized according to various customer needs, such as viscosity, thickness, and shape.
Recently, CNI Technology developed the world's first electromagnetic shielding solution
for not only LGA packages but also BGA packages.
Key Features
- Easy attach and detach of semiconductor packages
- Suppress adhesive peeling
- Suppress outgassing
- Optimized adhesion properties
- Excellent thermal/chemical stability
