끊임없는 열정으로 항상 발전하는 씨앤아이테크놀로지가 되겠습니다.

Sputter is high utilization in various industries and it has a benefit for electrode deposition.
The sudden reduction in the luminescence uniformity that is caused by the resistance of the transparent electrode (oxide-based) can be cleared by
deposition on major and secondary electrode through this sputtering tool.

Key Features - In-line sputtering system
- Substrate size : 200mm x 200mm
- Reactive sputtering : SiO2, TiO2, Nb2O5
- Plasma source : ICP
- Thickness non-uniformity : < ±5%
- Uniformity of RTR : < ±3%
- Alignment : mechanical align(< 50㎛)